Siemens launches Calibre 3DThermal software to continue the 3D IC market

Calibre 3DThermal provides complete internal chip and package thermal analysis for 3D ics, helping to address design and validation challenges from early exploration of chip design and 3D assembly to project Signoff The new software integrates advanced design tools from Siemens to capture and analyze thermal data throughout the design process Siemens Digital Industry Software…